Technische Spezifikationen
Package
Ceramic PGA
Mounting
Through-Hole
Temperature Range
-55°C to +125°C
Grade
Space
Manufacturer
BAE Systems
S E L
>125 MeV-cm²/mg
T I D
300 krad(Si)
Density
16Mb
Voltage
3.3V
Access Time
25ns
Organization
1M x 16
datasheet local
NOT_FOUND
datasheet source
no_scraper_match
Certifications
MIL-PRF-38535ESCC 9000
Anwendungen
SpaceMilitaryAerospace
Kompatible Alternativen
Other components in the Memory category — verify compatibility before substitution
R1LP0408DSP-5SI#B0
Renesas
SOP-32 · Industrial
IS62WV51216BLL-55TLI
ISSI
TSOP II-44 · Industrial
R1LV0416DSA-5SI
Renesas
SOP-32 · Industrial
IS61WV51216EDBLL-10TLI
ISSI
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R1LV0416RSA-5SI#S0
Renesas
SOP-32 · Automotive
CY62157EV30LL-45BVXI
Infineon/Cypress
FBGA-48 · Industrial
CY62167EV30LL-45ZXI
Infineon/Cypress
TSOP II-44 · Industrial
IS62WV51216EBLL-55TLI
ISSI
TSOP II-44 · Industrial