Technische Spezifikationen
Package
TSOP II-66
Mounting
Through-Hole
Temperature Range
-40°C to +85°C
Grade
Industrial
Manufacturer
Winbond
Density
256Mb
Voltage
2.5V
Cas Latency
2.5
Burst Length
2,4,8
Organization
16M x 16
Clock Frequency
200MHz
datasheet local
NOT_FOUND
datasheet source
no_scraper_match
Anwendungen
IndustrialNetworkingConsumer
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